Lecture
notes and videos for EE 421 Digital Electronics and ECG 621 Digital
Integrated Circuit
Design, Fall 2014
December 8 – final exam - Monday, Dec. 8, 1 to 3 PM. (A practice exam is found here.)
December 3 – Lecture 28:
December 1 – Lecture 27:
14.1 Fundamentals of Dynamic Logic – 14.1.1 Charge Leakage, 14.1.2 Simulating Dynamic Circuits, 14.1.3 Nonoverlapping Clock Generation, and 14.1.4 CMOS TG in Dynamic Circuits – ch14_14_1_video
(40:45) and ch14_14_1_notes.pdf November 26 – Lecture 26:
November 24 – Lecture 25:
November 21 – Lecture 24:
12.1 (Static Logic Gates) DC Characteristics of the NAND and NOR Gates, 12.2 Layout of the NAND and NOR Gates, and 12.3 Switching Characteristics – ch12_12_1_video
(67:56) and ch12_12_1_notes.pdf November 14 – Lecture 23:
November 12 – Lecture 22:
November 5 – Lecture 21:
October 31 – Lecture 20:
October 29 – Lecture 19:
October 27 – Lecture 18:
October 24 – Lecture 17:
6.4 SPICE Modeling of the MOSFET – 6.4.1 Some SPICE Simulation Examples, 6.4.2 The Subthreshold Current, 6.5 Short-Channel MOSFETs, 6.5.1 MOSFET Scaling, 6.5.2 Short-Channel Effects, 6.5.3 SPICE Models for Our Short-Channel CMOS Process – ch6_6_4_video
(69:38) and ch6_6_4_notes.pdf October 22 – Lecture 16:
6.3 IV Characteristics of MOSFETs – 6.3.1 MOSFET Operation in the Triode Region, 6.3.2 The Saturation Region – ch6_6_3_video
(59:24) and ch6_6_3_notes.pdf October 20 – Lecture 15:
October 15 – midterm exam (open book, closed notes)
October 13 – Lecture 14:
October 8 – Lecture 13:
October 6 – Lecture 12:
October 1 – Lecture 11:
September 29 – Lecture 10:
September 24 – Lecture 9:
September 22 – Lecture 8:
4.1 Layout using the Active and Poly Layers – 4.1.1 Process Flow, 4.2 Connecting Wires to Poly and Active – ch4_4_1_video (64:05) and ch4_4_1_notes.pdf September 17 – Lecture 7:
3.2 Design and Layout Using the Metal Layers, 3.2.3 Current-Carrying Limitations, 3.2.4 Design Rules for the Metal Layers, 3.2.5 Contact Resistance, 3.3 Crosstalk and Ground Bounce, 3.2.1 Crosstalk, 3.2.2 Ground Bounce – ch3_3_2_video
(70:17) and ch3_3_2_notes.pdf September 15 – Lecture 6:
3.1 The Bonding Pad – 3.1.1 Laying Out the Pad I, 3.2 Design and Layout Using the Metal Layers, 3.2.1 Metal 1 and Via1, 3.2.2 Parasitics Associated with the Metal Layers – ch3_3_1_video
(59:45) and ch3_3_1_notes.pdf September 10 – Lecture 5:
September 8 – Lecture 4:
2.4 The N-well/Substrate Diode – 2.4.1 A Brief Introduction to PN Junction Physics, 2.4.2 Depletion Layer Capacitance, 2.4.4 SPICE Modeling, and 2.5 The RC Delay through an N-well – ch2_2_4_video
(63:58) and ch2_2_4_notes.pdf September 3 – Lecture 3:
2.1
Patterning - 2.1.1
Patterning the N-well, 2.2
Laying Out the N-well – 2.2.1
Design Rules for the N-well, 2.3
Resistance Calculation - 2.3.1
The N-well Resistor -
ch2_2_1_video
(58:52) and ch2_2_1_notes.pdf August 27 – Lecture 2:
August
25 – Lecture 1:
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