Homework assignments and Project Information for EE 421 Digital Electronics and ECG 621 Digital Integrated Circuit Design, Fall 2014

  

HW#20 – design and simulate, using the C5 process, the operation of a buffer that can take a signal from a 12u/6u (= Wp/Wn) inverter and drive a 30 pF load, A11.11, and A12.1, due Wednesday, Nov. 26     
HW#19 – A11.2, A11.4, and A11.5, due Monday, Nov. 24
HW#18 – A11.1 and A11.3, due Wednesday, Nov. 12  
HW#17 – A10.1, A10.3, A10.5, A10.7, and A10.9 due, Wednesday, Nov. 5  
HW#16 – Layout the bandgap reference used in the project discussed below. Make sure your layout DRCs and LVSs without errors. Email your zipped up proj_rjb (last two or three letters are your initials) directory to the course TA for grading before the beginning of class on Wednesday, Oct. 29.
HW#15 – A6.9, A6.11, and A6.13 due Monday, Oct. 27      
HW#14 – A6.5, A6.14, A6.20, and using Cadence generate the CV plots, Fig. 6.4, for W = L = 9u NMOS (S/D/B grounded) and PMOS (S/D/B connected to vdd!, that is, + 5V) transistors in the C5 process, due Wednesday, Oct 22.
HW#13 – A6.4, A6.6, and lay out, using the C5 process, a 1.5 mm x 1.5 mm padframe for fabricating a MOSIS tiny chip (see Tutorial 6 here for help). Your bare pads should use both metal3 and metal2, and via2s connecting the metals together (you did this layout already in HW#6), and have both schematic views and symbol views. Ensure the final layout is larger than 1.4 mm square but smaller than 1.5 mm square. Show that your padframe DRCs without errors, due Monday, October, 20.
HW#12 – A6.2, calculate, and verify with simulations, the frequency when the AC output voltage is half of the AC input voltage (assume the AC input voltage is 1 mV peak) in this circuit, due Monday, October 13
HW#11 – A5.10 and lay out a 1 pF poly–poly capacitor in the C5 process (extract the layout to show the capacitor is nominally 1 pF), due Wednesday, October 8
HW#10 – A5.1, A5.4, and lay out a 50k resistor using hi–res poly2 in the C5 process (extract the layout to show the resistor is nominally 50k), due Monday, October 6  
HW#9 – A4.3–A4.6 (use the C5 process for A4.6 and 6u/0.6u MOSFETs), due October 1  
HW#8 – A4.1–A4.2 and lay out, in the C5 process, a 1k resistor using undoped poly2 (turn in the layout and extracted views of the resistor), due Monday, September 29  
HW#7 – A3.4–A3.6 and lay out, in the C5 process, test structures (2) for measuring the plate and fringe capacitance between metal 1 and metal 2. Comment on your layout choices, due Wednesday, September 24  
HW#6 – A3.1–A3.3 and lay out a 40 pad padframe for a chip measuring 1.5 mm x 1.5 mm using the C5 process. Your pads should be made using Metals 3 and 2 connected together using Via2s. The pads should be 75 um x 75 um. Comment on your design choices, due Monday, September 22
HW#5 – A2.2–2.5 (do not DRC since we only have the rules from the C5 process where lambda = 300 nm), due Wednesday, September 17
HW#4 – A2.6–A2.8, due Monday, September 15
HW#3 – A1.1–A1.5 (again, use Cadence. Using other tools will result in zero credit) and A2.11, due Wednesday, September 10  
HW#2 – Using Cadence draft the schematic and symbol of a 10k resistive divider using n–well resistors in the C5 process as discussed in Tutorial 1, due Wednesday, September 3  
HW#1 – Determine (using hand–calculations), and verify with simulations, the signals in Figs. 1.21, 1.22
, and 1.23 if 5 uF capacitors are used in place of 1 and 2 uF capacitors, due Wednesday, August 27. Note that the point of this assignment is for you to review linear circuit analysis and to ensure that you can follow the homework guidelines.

Course projects  Read the policy on the course webpage concerning turning in late work. These projects are NOT group efforts. What you turn in should be your own work. 

 

Your project report should detail:

 

EE 421/ECG 621 project 

 

  1. In proj_f14.zip is a bandgap voltage reference schematic. A bandgap is a common circuit used for generating a voltage reference of approximately 1.25 V that doesn’t change [much] with temperature and VDD variations. Before beginning the project lay out this bandgap as mentioned above in HW#16. Note that I’ve already laid out the parasitic pnp device (the diode). 
  2. The second part of the project is to design a circuit that senses an input voltage (you should use the bandgap from part 1 in this circuit). The output of the circuit is a logic 1 (vdd) when the input is less than 12.5 V and a logic 0 (ground) when the input is greater than 12.5 V. The circuit’s input should draw no more than 10 uA of current and no less than 1 uA of current. The sensing circuit you design should have a built in hysteresis of at least 300 mV (but less than 600 mV). What this means, for 300 mV hysteresis, is that the output of circuit may go high when the input drops to 12.35 V and then low when the input goes beyond 12.65. This is the same thing found in a thermostat controlling your home’s heater. If you have your thermostat set at 70 degrees your heater may kick on when the temperature drops to 69 and then shut off when the house heats up to 71. This keeps the heater from cycling on and off. Characterize your design for VDD ranging from 4 to 5 V and for temperatures ranging from 0 to 100C. Note that your simulations should use a symbol of your total circuit (what you’ve designed and the bandgap reference) having 4 pins: vdd, gnd, Vin (the nominally 12.5 V signal), and Enable out. If you use global vdd! and gnd! then a symbol with two pins, Vin and Enable, is okay.
  3. Use your design from part 2 to enable a ring oscillator that drives buffers that drive a charge pump that supplies (nominally) 12.5 V with load currents ranging from 0 to 100 uA (the output of the charge pump is the input in part 2). Again characterize your design for vdd ranging from 4 to 5 V and for temperatures ranging from 0 to 100C. The final cell that I simulate should have vdd and ground connections (or use global vdd! and gnd!) with a 12.5 V output voltage (in other words your final design should have a symbol view). Note that in Spectre you can model the load current with a current pulse. Show how robust your design is for varying load currents (say a pulse from 0 to 100 uA or from 100 uA to 0 etc.) Some thought is required to demonstrate, via simulations, a robust design. I would also like you to discuss the efficiency of the design. Ideally all of the power supplied by vdd, vdd*AVG(I(vdd)), is equal to the power delivered to the load, VLOAD*ILOAD (see page 4 here). In a real circuit this won’t be the case since your circuit will dissipate power.
  1. For students taking ECG 621 increase the maximum load current specification from 100 uA to 300 uA.
   

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