TDC and other test structures

Contributors:

Vikas Vinayaka (vinayaka@unlv.nevada.edu)

Sachin P Namboodiri (puruss1@unlv.nevada.edu)


Chip organization

This chip is design using AMS .35µm SiGe process. It comprises the following circuits:

1)    2 TDC architectures

2)   An averaging circuit

3)   A wide swing op-amp

4)   A transimpedence amplifier (TIA)

5)   A 4-bit flash ADC

6)   An LC oscillator

7)   A comparator


Figure 1. Complete Layout


TDC 1

Signal name

Pin#

Start

51

Stop

49

Reset

48

b0-b9

2(B0),1(B1),60-53(B2-B9)

 

TDC 2

Signal name

Pin#

Start

5

Stop

7

Reset

6

b0-b5

8-13

 

 

LC Oscillator

Signal name

Pin#

VDD

76

Reset

77

Oscillator output

78

 

Wide swing Opamp

Signal name

Pin#

Vb1

70

Vb2

72

Vb3

14

Vb4

16

Vpcas

71

Vncas

15

Vbiasp

69

Vp

18

Vm

17

Out

19

 

Sense amplifier/Pre-amplifier (for comparator)

Signal name

Pin#

Sa_Clk

62

Sa_Inm

63

Sa_Inp

66

Sa_Outp

61

Pa_Inm

67

Pa_Inp

68

Pa_Outm

64

Pa_Outp

65

 

 

TIA

Signal name

Pin#

In

79

Out

45

 

4-bit Flash ADC

Signal name

Pin#

Ext_Clk_In

32

Clk_Div2_Out

33

Vin_VCO

34

VCO_En

35

VCO_Rrange

36

VCO_Rlow

37

ADC_In

41

Vrefp

42

Vrefm

40

b0

38

b1

39

b2

43

b3

44

 

 

TIA Averager

Signal name

Pin#

Avg_Out

23

tia3_Out

24

tia3_Vb

25

tia2_Out

26

tia2_Vb

27

tia1_Out

28

tia1_Vb

29

tia3_In

73

tia2_In

74

tia1_In

75

 

 

 

Power Supply

Signal name

Pin#

VDdw

4,21

vdde

47,31

gnd

3,20,30,46

 

 

 

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