Using TSVs (aka Thru-Wafer Vias) to Implement On-Chip Inductors

http://cmosedu.com/jbaker/projects/TSV1.jpg   http://cmosedu.com/jbaker/projects/TSV2.jpg

Above (left) showing the HFSS simulation of an inductor implemented using Thru-Silicon Vias (TSVs) and (right) an inductor fabricated in the Idaho Microfabrication lab

using TSVs.

 

The development of TSV technology at Boise State was supported by DARPA and started in 2000. While much of our work focused on using this technology for 3D

packaging (e.g., flip-chip for solder ball connections to adjacent die or to a carrier or package), the implementation of large-value inductors represents a novel use of the TSV.

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