Using
TSVs (aka Thru-Wafer Vias) to Implement On-Chip Inductors
Above (left) showing the HFSS simulation of an inductor implemented using Thru-Silicon Vias (TSVs) and (right) an inductor fabricated in the Idaho Microfabrication lab
using TSVs.
The development of TSV technology at Boise State was supported by DARPA and started in 2000. While much of our work focused on using this technology for 3D
packaging, the implementation of large-value inductors represents a novel use of the TSV.