Lab 8 - EE 421L 

Authored by: Steve Salazar Rivas, Adrian Angelo G. Fuerte, & John Patrick Buen 

Email: salazs3@unlv.nevada.edu

          fuerta1@unlv.nevada.edu

           buenj1@unlv.nevada.edu

December 3, 2019

Zipped-up directory: Chip5_f19

  

Prelab: For lab 8, we went through Tutorial 6 in order to learn about the design and layout of a padframe for fabrication, and how to place circuit layouts in a padframe for fabrication.

Layout Pad
Layout
Padframe
Padframe Symbol



Lab Description:

For the lab, we formed a group of three students  to work on this project. Our group consisted of John Patrick Buen, Steve Salazar, and Adrian Fuerte.
As a group, we will be placing our circuits on a chip that will be tested once it is fabricated.
The following chip will include the following:
-One or more course project (in this case the Boost SPS)
-A 31-stage ring oscillator witha  buffer for driving a 20pF off-chip load
-NAND and NOR gates using 6u/0.6u (W/L) NMOS and PMOS devices
-Transistors, both PMOS and NMOS, measuring 6u/0.6u where all four terminals of each device are connected to bond pads (7pads + common ground pad)
    -Only one pad will be needed for the common ground
-25k resistor laid out below and a 10k resistor implement a voltage divider



SchematicsConnectionsPin Names

25k Resistor 
  • In

  • Out


  • 15

  • 14



10k-25k Voltage Divider
  • In

  • Out


  • 22

  • 21



XOR Gate
  • A

  • B

  • VDD

  • Out




  • 17

  • 18

  • 16

  • 19





NAND Gate
  • A

  • B

  • VDD

  • Out


  • 36

  • 37

  • 35

  • 38



NMOS
  • Gate

  • Drain

  • Source


  • 28

  • 27

  • 29



PMOS
  • Gate

  • Body

  • Source

  • Drain


  • 25

  • 26

  • 24

  • 23



NOR Gate
  • A

  • B

  • VDD

  • Out


  • 40

  • 1

  • 39

  • 2



Oscillator Buffer
  • VDD

  • Out


  • 33

  • 34



Inverter
  • In

  • VDD

  • Out


  • 31

  • 30

  • 32



Pins not used for our components in our overall padframe...

Putting all of our components onto our padframe...


Overall padframe symbol


Pin numbering on padframe
 

Schematic view of all the components connected onto the padframe


Final padframe layout


Our final padframe layout underwent DRC nicely


Extracted view of our final padframe

The overall padframe layout with all of our components connected to their respective pins underwent LVS quite nicely

This is another verification of our net lists matching after undergoing LVS

In order to test our chip, we would need several off chip components...


This concludes Lab 8 (Chip5_f19).



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