Lab 8 - EE 421L 

Authored by:

Dominique Anguiano - anguian3@unlv.nevada.edu

Michael Ghisilieri - ghisilie@unlv.nevada.edu

Martin Jaime - jaimem5@unlv.nevada.edu

Billy Louis - louisb2@unlv.nevada.edu

October 26, 2016

  

Lab chip for this project:  Chip6_f16

 

Each test circuit should have its own power but ground should be shared between the circuits. 

Ground should be pin 20.

Power should not be shared between the circuits so that a vdd!-gnd! short in one circuit doesn't make one of the other circuits inoperable.

The image seen at the bottom of the page shows how the chip's pads correspond to the pins of the 40 pin DIP package we'll receive from MOSIS. 

  
Your chip should include the following test structures:

 

 

Chip Devices

The chip contains the following devices

    - A 31-stage ring oscillator with a buffer for driving a 20 pF off-chip load

    - NAND and NOR gates using 6/0.6 NMOSs and PMOSs

    - An inverter made with a 6/0.6 NMOS and a 12/0.6 PMOS

    - 6u/0.6u PMOS and NMOS devices

    - 25k and 10k resistors, one made using n-well and the other using hi-res poly2. Voltage divider implemented with 10k resistors.


Chip Schematic
media/chip-schem.PNG
Chip Layout with passing LVS and DRC
media/chip-layout-LVS_DRC.PNG

 

 

Testing Manual

 

 

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