Wire Bonding
Technician
Craft
Produced by Daniel Senda
Page Information
·
This page is intended to
demonstrate some wire bonding jobs that Daniel has done while working in the
Dr. Baker Research Group.
·
Wire bonding is the process
of connecting a chip to a package using thin gold wire. Before the process can
begin, the chip must be adhered to the package, which is usually done by gluing
the chip to the package. At times, it is easier to solder the package to the
PCB before adhering the chip to the package. Also, there are some occasions
when the chip is adhered directly to the PCB (chip-on-board setup).
·
The wire bonding machine
that the group uses is the K&S 4500 Series manual wire bonder (Model 4526).
·
The next step is to secure
the chip and package to a work-holder and set it up on the wire bonding machine.
Also, the wire bonding machine needs to be adjusted to the correct parameters.
Once the adjustments are completed, the wire bonding can begin.
·
Below are a few pictures
that show some finished jobs.
SSOP-28 Package Wire-bonded Chip
(First Official Wire-bonding Task)
44-Pin Package Wire-bonded Chip
(Voyager VDDN)
SOIC-28
Package Wire-bonded Chip
TO8
Package Wire-bonded Chip
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