Lab 8 – Generating a Test Chip Layout for Submission to MOSIS

EE 421L Digital IC Design

Lab Date: 11/27/19     Due: 12/04/19

By Bryan Kerstetter        – Email: kerstett@unlv.nevada.edu

By David Santiago          – Email: santid4@unlv.nevada.edu

 

// By Mohammed Islam          – Email: islamm1@unlv.nevada.edu

 

Last Edited on 12/04/19 at 3:26 using Word

Files can be found here

David Santiago

-Provided Boost SPS

-Layout

-Lab Report

Bryan Kerstetter

-Provided Clock Multiplier

-Chip Layout

-Aided in Lab Report

Muhammed Islam

-Aided in layout of voltage divider and ring oscillator. Joined another group.

 

 

  

Lab description:

In this lab, we will be taking layouts and placing them on a 40-pin pad frame that will be fabricated by MOSIS.

 

 

 

Prelab:

We will be using the Tutorial Libraries created from CMOSedu.com.

 

Starting by copying Tutorial 5 into a new library, Tutorial 6:

 

Creating a new layout, “pad_75u”, with a metal3 75μm square, and glass 63μm square, with 6μm distance of separation:

 

 

Creating an input/output metal3 pin, “pad”, on top of the entire pad.

 

For the big 40 pin layout, we will have a max size of 1.5mm on any side, and 10 squares per side (plus 2 for the corners).

Therfore, 1.5mm / 12 = 125μm cell size. So, let’s create a text layer (ignored in MOSIS ruleset), of 125μm x 125μm:

 

Pad DRC:

 

Creating a new layout cell, “padframe”, and instantiating the pad, and then applying an input/output pin “pin<1>” on metal3:

 

Doing the whole square:

 

We see the textboxes really helped with setting the distances between the squares.

Go back to the original single pad, and delete the textbox. Check and save.

 

After that, relabel every pin on the square to “pin<1>,pin<2>, …pin<40>”

 

 

DRC of the padframe:

 

Creating a pad schematic and padframe schematic (Use Check -> Find Marker to ignore the floating pin):

Schematic for a single pad:

 

Symbol for single pad:

 

Schematic of the padframe:

 

Symbol of the padframe:

 

 

Creating a schematic cell, “chip”:

 

 

 

Check and Save:

 

There are unused pins in the padframe. This is ok. We will ignore these warnings by clicking Check -> Find Markers, and hit Ignore:

 

Alternative (if you have problems with the DRC not accepting the ignore requests):

Instantiate a cell, “noConn”, from the basic library:

 

In this part, I will organize my noConn connections based on the array sizes.

For the first array (pin<2:3>), instantiate an array of noConn connections, I#<2:3> (where “#” is a number) by pressing q and doing the following:

 

Creating busses and following this pattern:

 

Laying out everything (Focusing on just getting everything to LVS):

 

Connections at Ring Oscillator:

 

NAND:

 

 

Inverter:

 

PMOS:

 

NMOS:

 

R_div:

 

Ring Oscillator:

 

 

Final Layout:

 

Grand DRC:

 

Grand Extracted:

 

Grand LVS:

 

 

--------------------------------------------------------

Lab Schematic:

For this lab, we will place many components into a schematic, and then place the layouts into a padframe.

 

Creating a Cadence Library, “Chip1_f19”, with “Chip1_f19” as the main layout and schematic cell.

After that, looking at a cell that is instantiated in a different Library, and copying the highest hierarchy with the following settings:

 

This will then copy everything that was needed for the main hierarchy cell:

 

The other main thing that will be useful is a buffer that is able to drive an off-chip capacitance from a scope probe.

 

Here is the buffer system:

 

With this system, we have a 2-stage inverter which will “buff” the signal going through the buffer all the way to a heavy 30pF Off-Chip Capacitive load.

The diodes at the output will protect the output and let the current run into the diodes, and not into the output.

 

David S’s Boost Switching Power Supply:

 

Pins used:

Chip Pin #

Pin Description

Comments

32

VDD_DS

Power Supply DS

33

Out_DS

Boost SPS DS (NMOS)

34

Vout_DS

Boost SPS DS (Sense)

35

gnd!

Ground

36

gnd!

Ground

37

VDD_DS

Power Supply DS

 

How to test:

1. Connect VDD_DS together to a power supply. Ground can be common to other components in the circuit.

2. Pin<33> will be connected to an Inductor (65μH to 85μH) that is connected to VDD_DS and the Anode of a Schottky diode (1N5711 or 1N5819 will work).

3. Pin<34> will be connected to the Cathode of the Schottky diode, as well as a capacitor (5μF-30μF) and a 375Ω resistor. The voltage at Pin<34> will be around 7.5V, and the current load can range from 0mA-20mA. A 2mA load is 3.75kΩ.

4. If done correctly, there will be a ripple voltage of around 3mV-10mV.

 

 

------------------------------------------------------------------

Bryan’s x4 Clock Multiplier

 

Chip Pin #

Pin Description

Comments

22

In

4x Clock Multiplier

19

S1

21

S2

23

Ain

 

 

-----------------------------------------------------------------------------

31-Stage Ring Oscillator

 

 

Pins used:

Chip Pin #

Pin Description

Comments

38

Osc_out

This is the output of the Ring Oscillator, connected to a buffer with ESD protection.

 

Hand Calcs:

 

 

We ended up using the same size inverters (12/6), and increased the number of stages to 5, with a multiplier of 4.

This will be enough to drive a 20pF load.

How to test:

1. The output of the Ring Oscillator will be connected to pin<38>.

2. The power supply of the ring oscillator will come from an internal global vdd! while the grounding of the oscillator will come from pin<20>.

3. The frequency will be around 500KHz, at VDD = 5V.

Simulation Result:

 

Frequency = 500kHz

 

-------------------------------------------------------------------------------

NAND Gate

 

Pins used:

Chip Pin #

Pin Description

Comments

1

A NAND B

The Output of the NAND Gate

40

B

Input B to the NAND Gate

2

A

Input A to the NAND Gate

 

How to test:

1. Connect one input, A, to pin<2>, and the other input, B, to pin<40>.

2. The output of the NAND gate will be on pin<1>.

3. The power supply and grounds are connected internally to the chip.

4. The output will be the truth table to the NAND gate.

Image result for NAND truth table

 

NOR Gate

 

 

Chip Pin #

Pin Description

Comments

5

A

Input A to the NOR Gate

4

A NOR B

Output of the NOR Gate

3

B

Input B to the NOR Gate

 

How to test:

1. Connect one input, A, to pin<5>. Connect the other input, B, to pin<3>.

2. The output of the NOR gate will be on pin<4>.

3. The power supply and grounds are connected internally to the chip.

4. The output will be the truth table to the NOR gate.

Image result for nor truth table

 

--------------------------------------------------

The Inverter

 

Pins used:

Chip Pin #

Pin Description

Comments

7

A

Input of the Inverter

6

Ai

Output of the Inverter

 

How to test:

1. Connect one input, A, to pin<7>.

2. The output, Ai, will be connected to pin<6>.

3. The power supply and grounds are all internally connected to the rest of the circuit.

 

------------------------------------------------------

NMOS

 

Pins used:

Chip Pin #

Pin Description

Comments

11

Source NMOS

General-Purpose 6μ/600n NMOS, Body tied to GND!

12

Gate NMOS

13

Drain NMOS

 

How to test:

1. Connect Source pin<11> to a low potential voltage, such as ground (gnd!).

2. Connect Drain pin<13> to a high potential voltage, such as VDD or some other resistive input.

3. To connect to the gate of the NMOS, use pin<13>.

4. The body of the NMOS is automatically tied to GND!

 

-------------------------------------------------------------------------------

PMOS:

 

 

Pins used:

Chip Pin #

Pin Description

Comments

26

Gate PMOS

General-Purpose 6μ/600n PMOS.

27

Drain PMOS

24

Body PMOS

25

Source PMOS

 

 

How to test:

1. First, tie Source pin<25> to a high voltage, such as VDD!

2. Tie Body pin<24> to a high voltage, such as VDD!

3. Connect Drain pin<27> to a low potential, such as GND! or a resistor.

4. To control the PMOS, connect to pin<26> to control the gate of the PMOS.

 

----------------------------------------------------------------------

Voltage Divider:

 

Pins used:

Chip Pin #

Pin Description

Comments

8

In_25k

Input/output of the voltage divider

9

In_10k

Output/input of the voltage divider

10

Attenuator out

Node between 10kΩ and 25kΩ

 

 

How to test:

1. For a 10/35 voltage divider, connect pin<9> to GND!

2. Now add the source voltage to pin<8>. To view the output, probe at pin <10>.

 

-----------------------------------------------------------------------

25kΩ Resistor:

 

Pins Used:

Chip Pin #

Pin Description

Comments

8

In_25k

Input/output of the voltage divider

10

In_10k

Output/input of the voltage divider

 

How to test:

1. Use pin<10> to input a voltage.

2. Do not connect anything to pin<9>.

3. Use pin<8> as the other side of a 25kΩ resistor.

 

 

Complete Schematic:

 

Layout:

 

LVS:

-------------------------------------

Pin

Pin Value

Grouping

1

A NAND B

 

2

NAND Input A

3

NOR Input B

 

4

A NOR B

5

NOR Input A

6

Inverter Out

 

7

Inverter In

8

in_25k

 

9

in_10k

10

attenuator_out

11

NMOS Drain

 

12

NMOS Gate

13

NMOS Source

14

No Connect

15

16

17

vdd!

 

18

Clock Multiplier Out

 

19

Clock Multiplier S1

20

gnd!

 

21

Clock Multiplier S2

 

22

Clock Multiplier In

23

Clock Multiplier Ain

24

PMOS BodyZ

 

25

PMOS Source

26

PMOS Gate

27

PMOS Drain

28

No Connect

29

30

31

32

VDD_DS

 

33

Out_DS

34

Vout_DS

35

gnd!

 

36

gnd!

 

37

VDD_DS

 

38

No Connect

39

Ring Oscillator Out

 

40

AND Input B

 

 

 

Old Layout: