EE 421L:  Digital Integrated Circuit Design Lab - Lab 4

Author:  Gonzalo Arteaga

Email:  arteag1@unlv.nevada.edu

Due Date:  9/27/2017 

 

 

Lab 4: IV characteristics and layout of NMOS and PMOS devices in ON’s C5 Process

In this lab we practice laying out NMOS and PMOS transistors with probing pads attached to each terminal. The transistors are then characterized by generating Current vs. Voltage curves.

 

Making a Probe Pad:

The probe pads for each terminal in the MOSFETs are going to be smaller than a typical bonding pad. To design the probe pad, one should consult the design rules first. According to the design rules, the minimum probe passivation opening (minimum length/width) allowed is 20 micrometers. In addition to this, the amount of pad metal that overlaps the passivation opening should be at least 6 micrometers. Using these design rules, the probe pad can be laid out.

 

 

Dimensions of Probe Pad:

Glass Layer: L=W=22.5 um

Metal3: L=W= 36 um

 

 

Figure 1: Probe Pad Schematic

 

Figure 2: Probe Pad Symbol

 

Figure 3: Probe Pad Layout

 

 

NMOS and PMOS schematic and symbols:

Before laying out the transistors, a corresponding schematic and symbol is generated. The NMOS transistor’s length will be 600 nanometers and its width is 6 micrometers. The PMOS will have the same length as the NMOS but will have a width of 12 micrometers.

In a schematic window, the four-terminal MOSFET symbol is instantiated. Then pins and the probe pads are placed on each of MOSFET’s four terminals. Once the schematic is finished, a symbol is created which will then be used to create IV curves later in the lab.

 

 

Figure 4: NMOS schematic

 

 

Figure 5: NMOS symbol

 

 

Figure 6: PMOS schematic

 

Figure 7: PMOS symbol

 

 

Layout

For the layout, the probe pad created in the steps above was instantiated into the layout view. Once again, the design rules have to be considered when laying out multiple pads. According to the rules, the minimum distance between two unrelated Metal3 pads is 30 micrometers. As a result, the probe pads were separated from one another by 30 um.

 

The MOSFET was then instantiated in a way that allowed metal wires to be routed easily from the pads to the terminals. In addition to the MOSFET cells from the NCSU library, the following had to be added to the transistors to complete their design:  For the NMOS, a p-tap cell was instantiated in order to provide a connection to the body (p-substrate) of the NMOS. For the PMOS, an n-tap cell was instantiated next to the PMOS’s n-well so that a body connection could be made.

 

To minimize the resistance of the connections of the MOSFET to the probe pads, the routing wires were made considerably wide and multiple vias were instantiated in between the metal layers. The final layout for both NMOS and PMOS transistors is shown below,

 

 

Figure 8: NMOS layout zoomed out

 

 

Figure 9: NMOS layout zoomed in

 

 

Figure 10: PMOS layout zoomed out

 

 

Figure 11: PMOS layout zoomed in

 

 

 

DRC and LVS:

 The results after performing DRC and LVS are shown below for both layouts,

 

DRC

LVS

 

Figure 12: DRC results for NMOS layout

 

Figure 13: LVS for NMOS

 

Figure 14: DRC results for PMOS layout

 

Figure 15: LVS for PMOS

 

 

 

Simulations:

The following IV curves where generated by simulating the layout of the MOSFETS.

 

Schematic

IV Curves

 

Figure 16: NMOS simulation schematic

 

 

Figure 17: Id vs. Vgs curve with Vds = 100mV

 

 

Figure 18: Id vs. Vds with Vgs going from 0 to 5 volts in 1 volt steps.

 

 

Figure 19: PMOS simulation schematic

 

 

Figure 20: Id vs. Vsg curve with Vsd = 100 mV

 

 

Figure 21: Id vs. Vsd with Vsg going from 0 to 5 volts in 1 volt steps.

 

 

 

 

 

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